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Your current position is < Home< Technological target
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Items
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Capacity
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2019
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2020
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Max. Layer
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36L
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38L
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40L
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Width/Space
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Inner layer
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75/75um
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50/50um
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50/50um
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Out layer
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75/75um
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50/50um
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50/50um
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Minimum holes
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80um
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50um
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50 um
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Ratio
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12.5:1
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12.5:1
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15:1
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Copper thickness
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8 oz
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8 oz
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8 oz
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Impedance tolerance
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¡À10%
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¡À8%
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¡À5%
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high frequency /Microwave
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SV
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SV
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SV
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Halogen-free
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SV
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SV
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SV
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Lead-free
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SV
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SV
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SV
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Mixed pressing
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P
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P
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SV
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Metal base/core
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P
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P
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SV
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High Tg
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SV
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SV
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SV
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HDI
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1+C+1
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P
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P
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SV
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Rigid-Flex
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14 layers
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P
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P
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SV
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Buried capacitors, resistors
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P
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P
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SV
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Surface treatment
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OSP¡¢ENIG¡¢Selective Electricity¡¢Immersion Tin¡¢Immersion Silver¡¢HASL¡¢Etc.
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P:Samples£» SV:Low volume
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