Layers: 1--30layers
Max manufacturing size: 640mm*1100mm
Copper foil thickness: 0.5OZ-28OZ
Finished board thickness:
2-layer: 0.2mm-6.0mm
4-layer: 0.4mm-8.0mm
6-layer: 0.8mm-8.0mm
8-layer: 1.0mm-8.0mm
10-layer:1.2mm-8.0mm
12-layer:1.5mm-8.0mm
14-layer:1.5mm-8.0mm
16-layer:1.6mm-8.0mm
18-layer:2.2mm-8.0mm
20-layer:2.4mm-8.0mm
Min line width/space: 2.5mil/2mil
Min finished holes size: 0.15mm
Aspect ratio: 16:1
Impedance control: +/-10%
Surface treatment: HASL；HASL with Pb free
Immersion Gold; Immersion Tin; Immersion Silver
Gold Finger; Flash Gold; OSP
Materials: FR4, Tg: 130℃/210℃,Rogers,Arlon,Taconic
Bergquist, Thermagon,
Special technique: blind&buried holes, via in pad,
Semi-plating holes, countersinked holes,
Step mounting holes, controlled depth holes
Edge-plating PCBs and metal base PCBs |
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